Chip On Board
COB, or Chip On Board, is fully aligned with the miniaturization of electronic devices.
This process involves placing silicon (the core of electronic components, without its plastic casing) onto a substrate.
The interconnection between the two elements is made using wires 4 times thinner than a human hair.
This interconnection technique between the electronic chip (Die) and its substrate is called Wire Bonding.
COB Area 1
ISO 7 certified cleanroom equipped with 4 complete Chip On Board production lines
- Individual extraction of silicon cores or 'Dies' from the 'Wafers' (purchased or provided by our clients) and placement with an accuracy of around 10 microns in all 3 axes
- Adhesives and resins exclusively without silicones, applied with precision to the tenth of a milligram
- Various methods for applying the adhesive: jetting, stamping, time-pressure, or even screw conveyor
- Electrical connection of the component via aluminum 'wire bonding' after polymerization
All our lines are equipped with dispensers for applying protective resins, which can be single-component, two-component, or UV-activated.
COB Area 2
ISO 7 certified cleanroom equipped with a dedicated COB production line for silicone-based adhesives, isolated from the rest of the workshop
- Individual extraction of silicon cores or 'Dies' from the 'Wafers' (purchased or provided by our clients) and placement with an accuracy of around 10 microns in all 3 axes
- Silicone-based adhesives
- Various methods for applying the adhesive: jetting, stamping, time-pressure, or even screw conveyor
- Electrical connection of the component through 'gold wire bonding,' meaning the use of gold connection wires
Plasma cleaning cabinet for substrates to ensure optimal surface quality for bonding or wire bonding operations.