Advanced protection and integration
For over 30 years, ml&s Suisse SA has been developing and mastering thermoplastic overmolding technology for the protection of electronic boards (PCBA) and components. This solution provides the product with exceptional sealing and robustness by encapsulating all components in an injected casing, protecting them from external aggressions. The principle is to limit open interfaces with the external environment.
The main advantage of overmolding is its ability to ensure a high level of sealing (from IP54, IP68 to IP69K), enabling the product to be used in extreme conditions (humidity, dust, high-pressure cleaning, temperature variations, etc.).
This technology allows the creation of complex, multifunctional topologies, directly integrating:
- Mechanical fixings (metal inserts, clips, mounting sleeves, etc.)
- Overmolded connectors (plugs, cables, contacts, etc.)
- Specific functions (detection, user interface via LEDs, two-material designs, etc.)
- Visual customization (colors, markings, etc.)
The process can be carried out using mono-injection or bi-injection, allowing the combination of multiple materials or properties in a single part. Thanks to modular design and the optimization of our tooling, we also offer great production flexibility: adaptation of product variants from a common platform without multiplying development costs.
The thermoplastic materials used (PA, PP, etc.) are selected or custom-developed based on the mechanical, thermal, electrical, or chemical requirements of your application. The choice of material pairs (body/connectors) is crucial to ensure the durability of the sealing and resistance to tearing or fatigue.
Thermoplastic overmolding thus provides an economical, reliable, and industrial solution, combining functionality, robustness, design, and integration, perfectly suited for demanding markets.