A proven solution for effective protection
We implement sealing and encapsulation processes that provide long-lasting protection for electronic boards (PCBA) against environmental, mechanical, and chemical stress. This technology involves encasing the electronic module in a polymer resin (such as polyurethane, epoxy, etc.), poured into a specially designed casing, thereby creating a physical and chemical barrier around the sensitive components.
Sealing achieves a high level of waterproofing and resistance, particularly in demanding environments such as humidity, dust, mechanical shocks, chemical agents, or autoclave sterilization treatments. Depending on the requirements of your application, we offer tailored technical solutions, ranging from standard encapsulation to robust, custom formulations (IP54, IP68 to IP69K). The choice of material, formulation, and process depends on the specific demands of the application.
With our expertise, we develop durable and reproducible protection for your electronic subassemblies, in compliance with the most demanding industrial standards.