COB (Epoxy and Silicone)
Chip on Board (COB) is an electronic assembly technique where semiconductor chips (or dies) are directly mounted and connected to a printed circuit board (PCB) or substrate, without individual packaging.
Benefits:
- No package around each chip, resulting in reduced space requirements
- Reduction in material and volume costs
- Heat dissipation is more direct since the chip is close to the substrate
It is a process that offers more functional possibilities than standard methods while allowing for greater design flexibility.