Flip-Chip
Flip-Chip technology is an efficient method for assembling a chip onto a substrate so that its active surface (the one containing the connections) is in direct contact with the substrate. By handling the chip on automated component placement machines (SMT line) and using reflow soldering, the assembly process takes the same amount of time as for any other surface-mounted component, regardless of the number of interconnections to be made. In some cases, a specific adhesive (Underfill) can also be applied under the component to improve its mechanical reliability.
The advantages are numerous:
- Connections are not limited to the perimeter of the chip; they can cover the entire surface
- Since the connections are shorter and more direct, communication between the chip and the rest of the electronic board is improved
- Flip-chip allows for more compact designs